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The 27th
Semiconductor, Sensor & Packaging Expo
Specialized exhibition on semiconductor back-end processes ISP
Date: January 21 (Wed) ~ 23 (Fri), 2026 10:00~17:00
Venue: Tokyo Big Sight
What is the Semiconductor & Sensor Packaging Expo?
Previous Venue Scene
This exhibition is a specialized exhibition specializing in semiconductor back-end processes, where technological innovation such as 2.5D/3D, chiplets, and heterogeneous technology is progressing.
It is a great exhibition to expand sales channels to manufacturers of semiconductors, sensors, electronic components, electronic devices, automobiles, etc., with all kinds of packaging technologies such as semiconductor assembly equipment, inspection equipment, packaging materials, plating and etching.
Exhibits
Assembly Equipment, Packaging Materials/Components, Analysis/Simulation Software for IC Packaging, Semiconductor Device Inspection Equipment, SATS/Contract Design Services, Plating/Etching Materials/Equipment, MEMS Device Manufacturing Equipment
Including this exhibition, it will be held in Nepcon Japan, which consists of the following exhibitions.
Advantages of exhibiting
We can expand our sales channels to electronic equipment and semiconductor manufacturers.
You can also promote it to overseas manufacturers.
From lead acquisition to business negotiations, you can do it smoothly
Advisory Committee
We are grateful for the cooperation of the following people who are active on the front lines of this field.
Hisamitsu Yamamoto
Kamimura Kogyo Co., Ltd. Deputy
General Manager
, Development Division, Central Research Laboratory,
Second Development Department
Tomoaki Takubo
KIOXIA Corporation Chief
Post-Process Technology Engineer
Hironori Mori
Director
,
Information and Communications Materials Laboratory, Sumitomo Bakelite Corporation
Takashi Matsumoto
General Manager,
ASIC Technology Department,
Semiconductor Division, DENSO Corporation
Katsuhiko Suzuki
Japan Samsung Device Solutions Research Institute
, Advanced Package Lab
Part Manager
Kosuke Azuma
General Manager, Packaging Technology Development Department
, Production Division, Renesas Electronics Corporation
Concurrent Exhibitions
Service Units Japan Ariake Co., Ltd..
ADRESS 104-0061
Ginzaitchōme 22-ban 11-gō Ginza Ōtake bijidensu 2 F Chūgoku
E-MAIL: ariakejp1@gmail.com
http：//www.ariakejp.com
Priority is given to email contact
VIP Members Club
post code：104-0061
ADRESS ： 22-ban 11-gō Ginza Ōtake bijidensu2F
E-MAIL: ariakejp1@gmail.com
http：//www.ariakejp.com